IC Mold Solutions: ASSAB High Performance Tool Steel
Performance for Precision
Advanced materials ensuring accuracy in IC molding.
Market Trend Snapshot
- The accelerating adoption of electric and autonomous vehicles is driving substantial demand for advanced semiconductor components, thereby necessitating high-precision molding equipment to enable efficient and scalable production.
- Significant investments by governments and private enterprises in semiconductor manufacturing capabilities are aimed at strengthening domestic production and reducing dependency on imports, which in turn reinforces the demand for advanced molding solutions.
- The widespread deployment of 5G technology requires sophisticated semiconductor components for communication infrastructure and devices, creating a growing need for specialized molding equipment capable of delivering high-performance outputs.
Essential Properties of Tool Steels for IC Mold
- Excellent Heat Resistance: IC molding involves high processing temperatures. Tool steel must maintain hardness and structural integrity under thermal stress to prevent softening or deformation, ensuring consistent mold performance and long tool life.
- High Compressive Strength: During molding, the steel experiences significant clamping and injection pressures. High compressive strength prevents deformation or cracking under these loads, maintaining dimensional accuracy of the mold cavity.
- Superior Wear Resistance: Repeated cycles of molding and contact with abrasive compounds can erode the mold surface. Wear-resistant steel minimizes surface degradation, reducing maintenance and extending tool life.
- Dimensional Stability at Elevated Temperatures: Thermal cycling can cause distortion if the steel lacks stability. Dimensional stability ensures the mold retains precise geometry, which is critical for IC components requiring micron-level tolerances.
- EDM Machinability: Electrical Discharge Machining (EDM) is commonly used for intricate mold features. Good EDM machinability allows efficient processing without introducing microcracks or compromising surface integrity.
- Cleanliness: A clean, homogeneous microstructure improves polishability and reduces risk of defects in molded parts, which is essential for high-quality semiconductor packaging.
- Coatability: Surface coatings like PVD and hard chrome electroplating enhance wear, corrosion resistance and anti-sticking properties. The steel supports strong adhesion of these coatings.
- Corrosion Resistance: IC mold requires corrosion resistance for several critical reasons related to maintaining mold performance, ensuring product quality, and extending the mold’s lifespan in a demanding production environment.
ASSAB Tool Steel for IC Molding
- ASSAB PM23 SuperClean: The standard tool steel for IC molding.
- ASSAB PM30 SuperClean and ASSAB PM60 SuperClean: Ideal for high duration.
- Elmax SuperClean: Offers wear resistance and corrosion resistance.
- Tyrax ESR: Known for cleanliness and corrosion resistance.
| Steel Grade | Key Properties | Why Recommended | Typical Application |
|---|---|---|---|
| ASSAB PM23 SuperClean | • Excellent wear resistance • High compressive strength • Dimensional stability | Standard choice for IC molding due to its ability to withstand abrasive epoxy compounds and maintain precision under thermal/mechanical stress | Standard cavity inserts |
| ASSAB PM30 SuperClean | • Higher wear resistance and compressive strength • Good thermal stability | Ideal for molds exposed to frequent thermal cycling and high-volume production | Inserts for long-duration molding |
| ASSAB PM60 SuperClean | • Superior wear resistance and compressive strength • Excellent thermal stability | Best suited for extreme durability in continuous operation, reducing downtime | High-volume IC molding tools |
| Elmax SuperClean | • High wear resistance • Corrosion resistance | Perfect for molds with chemical exposure, ensuring extended tool life | Precision molds in corrosive environments |
| Tyrax ESR |
• Superior cleanliness • Excellent corrosion resistance • Excellent polishability | Ensures defect-free surfaces and strong coating adhesion for advanced IC molding processes | Certified for several IC mold insert |
ASSAB One Stop Service
Heat treatment
IC molds require tightly controlled heat-treatment parameters, from heating and quenching to subzero cycles and tempering, to achieve exceptional dimensional stability and wear resistance. Multiple subzero treatments are often applied to minimize retained austenite, ensuring consistent performance and long-term reliability. With decades of specialized experience, ASSAB has perfected heat-treatment practices specifically for IC mold applications, delivering repeatable results that enhance tool life and maintain precision under demanding conditions.
PVD coating service
ASSAB provides PVD coating services to enhance the functionality and life of IC mold. Our recommendations are:
| CrN / CrN Multilayer: Corrosion‑and‑oxidation resistant multilayer PVD for thicker protection and low friction. Key specs: Hardness 2,000–2,300 HV Thickness 1–6 µm (multilayer 2–6 µm) Tmax ~600 °C µ friction ≈0.2–0.4. Choose for cores/inserts exposed to chemicals, deposits or heavy abrasion. | TiN‑ultrafine: ultrafine arc PVD delivering a smooth, defect‑free gold layer for general IC cavities. Key specs: Hardness ~2,800 HV Thickness 2–4 µm Tmax ~500 °C. Best for abrasive, filled resins where polishability and reliable release matter. |